75.04Ni14.05Al10.41Cr0.5Hf High Entropy Alloy Sputtering Target

75.04Ni14.05Al10.41Cr0.5Hf High Entropy Alloy Sputtering Target is a custom multi‑principal‑element Ni‑Al‑Cr‑Hf alloy target material for magnetron sputtering and PVD thin‑film deposition. As a professional manufacturer of advanced sputtering targets, we fabricate this HEA target with strictly controlled atomic ratio: 75.04at% Ni,14.05at% Al,10.41at% Cr, 0.5at% Hf. Custom dimensions, shapes including circular, rectangular and rotary target can be processed according to customer drawings.

This 75.04Ni14.05Al10.41Cr0.5Hf high entropy alloy sputtering target combines the advantages of nickel‑aluminum base alloy plus chromium and hafnium doping. It features uniform internal microstructure, low impurity content, high density and good sputtering consistency. The addition of trace hafnium improves high‑temperature stability, oxidation resistance and thin‑film comprehensive performance of deposited coatings.

Our 75.04Ni14.05Al10.41Cr0.5Hf HEA sputtering target is widely used for PVD hard‑coating deposition, thin‑film material research, surface modification, functional film preparation and related new‑material development fields. Bonding service with copper back‑plate is available upon request to meet magnetron sputtering working requirements.

Every batch of 75.04Ni14.05Al10.41Cr0.5Hf high entropy alloy sputtering target goes through strict composition testing, density inspection and microstructure analysis before delivery. We support laboratory small‑order samples as well as industrial‑volume bulk supply. Related technical documents such as inspection report and MSDS can be provided. Whether for academic laboratory research or industrial thin‑film production, our custom HEA sputtering target can satisfy your strict technical requirements.

High Purity:

Multiple purity grades available: 3N / 4N / 5N / 6N (99.9% ~ 99.9999%), ultra-low impurity content, stable and consistent material performance.

Excellent Electrical & Thermal Conductivity

Outstanding electric and thermal conductivity, widely applied in electronics, heat sinks, batteries, conductive components, semiconductor, sputtering targets and heat dissipation fields.

Mirror Smooth Surface Finish

Flat, polished, contamination-free surface, greatly improves follow-up coating, welding, cutting and other secondary processing effects.

Advantage

High Ductility & Malleability

Superior forming performance, easy to bend, stamp, roll without cracking during processing.

Superior Corrosion Resistance

Stable anti-corrosion property under diverse working environments, guarantees long service life for industrial scenarios.

Versatile Custom Processing

Supports cutting, bending, stamping, CNC machining and size customization as per client’s technical drawings and requirements.

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Targets, Powder, Foil, Wire, Rod & Profiles

We specialize in advanced new materials with 100,000+ stock SKUs, custom R&D and OEM processing. Full production lines from smelting to precision machining support small & non-standard orders. We fabricate targets, powder, foil, wire, rod and profiles of almost all safe elemental, alloy, compound and composite materials, featuring high purity, great conductivity, smooth surface, good ductility, corrosion resistance and flexible processing.